Sapphire Substrate - R-Plane

R-plane sapphire substrates are preferred for the hetero-epitaxial deposition of silicon used in microelectronic IC applications.  Improved fabrication processes ensure no subsurface work damage and the exceptionally smooth surface finish and high dielectric constant can make sapphire an excellent choice for hybrid substrates, particularly for microwave ACs.  

Additionally, after undergoing an epitaxial silicon deposition process, r-plane substrates are useful in high-speed IC and pressure transducer applications.  Other applications include the growth of thallium and other super conducting compounds, high impedance resistors, the growth of GaAs or as a stable platform for carrying or bonding other materials.


Sapphire Substrate Slice
Sapphire Substrate Surface Profile

Standard Specification

Material Czochralski grown sapphire (>=99.995% High Purity monocrystalline Al2O3).
Surface Orientation R-Plane (1 1 0 2) surface orientation. Surface oriented within 2-degrees. Offcuts are available.
Crystallinity No visual evidence of slips, twins, lineage or fractures
Dimensions   Outer Diameter 50.8mm ± 0.1mm, 76.2mm ± 0.25mm, 100.0mm ± 0.4mm
125.0mm ± 0.4mm, 150.0mm ± 0.5mm
  Thickness 625μm ± 10μm, 500μm ± 10μm, 430μm ± 10μm, 330μm ± 15μm
  Surface Flatness <25μm, depending on thickness
  Surface Bow <25μm, depending on thickness
  Surface Taper <25μm, depending on thickness
  Primary Flat Length 16mm ± 1mm, 22mm ± 1mm, 32.5mm ± 1mm, 42.5mm ± 2.5mm
  Primary Flat Location 45-degrees ± 2° from the projection of the c-axis in the r-plane
Edges The edges of the substrates have a ground finish.
Edge Chips Edge defects in general will not exceed those stated in SEMI M3-91.
Frontside Surface Finish A smooth, polished surface finish suitable for epitaxy. No visible scratches, pits, dimples or contamination allowed. Ra typically < 0.20nm.
Backside Surface Finish Depends on whether wafer is single side polished or double side polished. SSP: Fine ground, Ra typically 0.4 to 1.5μm. DSP: Polished.
Note Other wafers orientations are available, including A-plane (1 1 -2 0), C-plane (0 0 0 1) and M-plane (1 -1 0 0).

The data above is representative only, with a combination of data from our suppliers, and should not be considered absolute or warrantable. Specifications will be in given in our quotations and additional information is available on request. For a quotation please do not hesitate to contact us with your specific requirements.